取消
BDN11-3CB/A01
Thermal - Heat Sinks
CTS Thermal Management Products
HEATSINK CPU W/
-
Box
1333
-
: 1333

1

2.41

2.41

10

2.346

23.46

25

2.284

57.1

50

2.1512

107.56

100

2.0282

202.82

250

1.90516

476.29

500

1.83364

916.82

1000

1.64913

1649.13

5000

1.61838

8091.9

BDN11-3CB/A01
BDN11-3CB/A01
Thermal - Heat Sinks
CTS Thermal Management Products
HEATSINK CPU W/
-
Box
1333
-
TYPEDESCRIPTION
MfrCTS Thermal Management Products
SeriesBDN
PackageBox
Product StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length1.110" (28.19mm)
Width1.110" (28.19mm)
Diameter-
Fin Height0.355" (9.02mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow7.20°C/W @ 400 LFM
Thermal Resistance @ Natural20.90°C/W
MaterialAluminum
Material FinishBlack Anodized
Shelf Life24 Months
Base Product NumberBDN11
captcha

008613590108500

点击这里给我发消息
0